Capabilities
Power electronics
Inverters and converters
DC-DC, DC-AC, AC-AC
High power density (15 W/cm3)
From ultra low power to 250 kW
High efficiency
High voltage
Wireless power transfer
Variable speed/frequency drives
Single and multiphase, high frequency
BLDC, induction, DC
Vector control, V-F
Lithium batteries
Battery safety and management circuits
Multi-cell and fast charging
Pack design and manufacturing techniques
Design for high pulsed load
Cell selection
Electrical
Magnetics
Safety devices and cable selection
Thermal management
Precision measurement
Analogue electronics
Low-noise design and layout
Tolerance analysis
Simulation (SPICE, MATLAB)
Mixed signal
ADC conversion
Multiple ground design
High-speed data acquisition
Digital signal processing
Sensors
Pressure
Printed sensors for industrial applications
Temperature
IR and thermoelectric measurement
Flow
Ultrasonic and hot wire (low cost/high precision)
Electromagnetic
Geophysical, subsea inspection
Electronics compliance testing
Technical file creation
FMEA, DFMEA, safety case, tolerance analysis
CE safety compliance
Consumer goods, IT equipment and appliances
MIL-STD
Aerospace, vehicles, environmental
Medical device
IEC 60601, IEC 62304
ATEX/IECEx
IEC 60079
Electrical
DNV OS-201
BS7671
EMC
Design review
PCB layout
Shielding
Cable and communication interface selection
System grounding and earthing
Manufacturing services
PCB
Manufacturing
Fabrication
Design services
Prototyping
Assembly
Modification
Electrical
Box builds
Control cabinets
Rapid prototyping
3D Printing
SLS
SLA
X-Ray inspection
100 nm feature recognition
µCT
Heated stage
Embedded electronics
Firmware
Low-level drivers
RTOS implementation
Middleware integration
UX/HMI development
System architecture
All common platforms and processor families
Ultra-low power design
Connected smart devices
IOT
Edge computing
Gateway design and cloud integration
Industry 4.0 and production automation/control
Communications protocols
NFC, BLE, WIFI, LTE, etc.
Physical and software
All common industrial control protocols
Machine learning/AI
Process optimisation
Predictive maintenance
Manufacturing consultants
Cost down
Cost analysis
Supplier selection
Critical component analysis
Architecture for low cost
DFx
Design for high-volume manufacture
Multiple SKU
Test methodologies
(EOL, BIST, etc.)
Mechanical integration
Support
Subcontractor management
CMO transfer
IP capture
Documentation review
Production scale-up
Fault and root-cause analysis
Competitor analysis
Device teardowns
Reverse engineering
Key component identification
Simulating key subsystems
COGS analysis
Design review and suggested improvements
Comparison with IP/specification
Performance testing/characterisation
Market analysis
Product positioning
USP identification
Gap analysis
Price vs performance
IP identification and analysis:
Patent review
Alternative technology comparisons
Intellectual property services
Patent review
Critical review to ensure coverage
For both in-creation and existing patents
Patent lawyer interface
IP landscaping
Review of existing patents
Identification of relevant patents
Suggestion of alternative technologies
Technology roadmap
Feasibility studies
Identification of TRL levels for key technologies
